发明名称 THERMOCOMPRESSION BONDING DEVICE
摘要 PROBLEM TO BE SOLVED: To require less accuracy required for a table supporting works of a thermocompression bonding device and reduce the cost of the thermocompression bonding device. SOLUTION: This device is composed of supporting means (6, 8) for mounting a plurality of works (3a, 3b) being arranged in the same plane and put in contact with parts of the lower faces of the works and moving the works to be positioned in a prescribed place in the plane, a thermocompression bonding head 16 moved relative to the supporting means to the direction of crossing the plane so as to contact the works positioned in the prescribed place by the supporting means and a compression bonding receiving means 17 (compression receiving block) opposed to the thermocompression bonding head 16 via the plane for clamping the works 3a, 3b across the thermoscompression bonding head 16. In the supporting means, a through-space is provided so as to cross the thermocompression bonding head 16 and the compression bonding receiving block 17 in the moving direction in the condition that the supporting means are arranged in the prescribed place.
申请公布号 JP2001035627(A) 申请公布日期 2001.02.09
申请号 JP19990205422 申请日期 1999.07.19
申请人 NEC SAITAMA LTD 发明人 SUNAGA KOJI
分类号 H01R43/02;H01R43/042;(IPC1-7):H01R43/042 主分类号 H01R43/02
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