| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacture in which an interposer board, etc., that performs test and evaluation of electrical characteristics for an IC element or an IC package with accuracy is supplied with ease. SOLUTION: This manufacturing method contains a process wherein one principal surface and the other principal surface of a conductive metal foil of thin plate 5 is coated selectively with etching resist films 6a and 6b, a process wherein one principal surface of the metal foil or thin plate 5 coated with the etching resist films 6a and 6b is half-etched to provide connecting terminals 5a protruding from one principal surface, a process wherein an insulator layer 7 is laminated on the surface where the connecting terminal 5a is provided, a process wherein the boards are laminated integrally by pressurizing and a tip part of the connecting terminal 5a is made to penetrate and exposed from a surface of the insulator layer 7, and a process wherein the integrated metal foil or thin plate 5 is etched selectively to form external connection parts 5a that are separately connected to the connecting terminals 5a. |
