| 摘要 |
PROBLEM TO BE SOLVED: To improve a cooling capacity even if a refrigerant is at a low flow rate by providing a first header for distributing the refrigerant to each channel in a parallel channel and a second header for merging the refrigerant flowing out of the parallel channel. SOLUTION: In a cooler 10 for a semiconductor element, an inflow port 2 for allowing a refrigerant 1 such as pure water and antifreeze solution and a first header 3 for distributing the refrigerant 1 to a parallel channel 4 that is connected to the inflow port 2 are provided, and the first header 3 is connected to the parallel channel 4. A second header 5 for merging the refrigerant 1 flowing out of each parallel channel 4 is provided, and the second header 5 is connected to an outflow port for allowing the refrigerant 1 to flow out. In this case, the width of each channel in the parallel channel 4 is set to 1.5 mm or less, the ratio of height/width is set to 10 or larger, and a number of channels are arranged in parallel with almost the same interval as the width, thus improving cooling capacity even if the refrigerant is at a low flow rate. |
