MOUNTING STRUCTURE AND BUMP STRUCTURE OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To prevent cracking of a bump at the solder joint of the electrode of a semiconductor device and a connection pattern formed on a substrate by arranging bumps densely at four corners of the semiconductor device as compared with other parts. SOLUTION: A semiconductor device 20 is a face down mounting chip wherein an electronic circuit is formed on the lower surface of a silicon substrate and electrodes 21 for connecting the electronic circuit with a substrate 30 are formed at the bottom face art along with a pattern 24. Bumps 22 for connection with a connection pattern 31 formed on the substrate 30 are formed on the electrodes 21 and a pattern 31 for connection with the electrodes 21, a pattern 32 for connection with dummy bumps 23 at four corners of the semiconductor device 20 and a circuit for connection with other electronic parts are formed oppositely to the bumps 22. According to the structure, connection strength can be enhanced at four corners of the semiconductor device 20 and thermal stress being applied to bumps 22 in the vicinity of four corners can be lessened.