| 摘要 |
PROBLEM TO BE SOLVED: To pick out process failure of a semiconductor device quickly by displaying a screen for designating an inspection region corresponding to a chip and an inspection result screen of a designated inspection region. SOLUTION: A region 1 is located at an upper part on a screen and a guidance region 2 describing the operation and state is located below. A region 3 located in the center of the screen comprises a screen 3a for designating the shelf number list of cassette and the inspection region of wafer, a screen 2b for inputting an inspection object or inspection conditions, and a screen 3c for displaying inspection conditions and inspection results wherein the contents to be displayed are changed depending on the operation or the state of progress. According to the arrangement, process failure of a semiconductor device can be picked up quickly.
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