| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip-component type light-emitting device that can be thinned easily and a method of its manufacture. SOLUTION: This light-emitting device is provided with a package, comprising an insulating substrate 15 having a through-hole 14, that penetrates in the thickness direction and a thin flat plate 13 that is fixed on a surface of the substrate in such a way as to close the penetrating hole 14, and an LED chip 16 mounted on the thin flat plate 13 in the through-hole 14. The thin flat plate 13 comprises mutually separated first and second thin metal plates, each of which is fixed to a discrete insulating member 24 by an insulating resin 13a and is fixed to the insulating substrate 15, so that the discrete insulating member 24 is positioned in the through-hole 14. Either of the positive electrode or the negative electrode of the LED chip 16 is connected to the first thin metal plate, and the other electrode of the LED chip 16 is connected to the second thin metal plate. |
