| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device which can be exactly mounted on a mounting substrate even when any foreign matter exists on the mounting substrate in a mounting process. SOLUTION: A die pad, a semiconductor element, a lead terminal 13, and metallic wire are sealed by sealing resin so that a package main body 15 can be constituted. Rectangular lead terminals 13 are exposed along the four sides of the package main body 15 in parallel on the back face of the package main body 15. The back face (mounting side face) of the package main body 15 is formed as a flat face, and a difference in level 16 being a recessed part is formed inside the lead terminals 13 at the central part of the flat face.</p> |
