| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting body of high reliability and productivity by improving fluidity of a sealing material used for mounting a semiconductor device which uses a conductive adhesive. SOLUTION: A semiconductor device 1 comprising an electrode pad 2, a substrate 6 comprising a terminal electrode 5, a bump electrode 3 provided at a part of the electrode pad 2, a flexible conductive adhesive layer 4, and a sealing layer 7 comprising a cured composition whose viscosity is not more than 100 Pa.s while thixotripy index is not more than 0.1, are provided. As a composition as main components, a resin binder which contains, for example, polyepoxide.acid anhydride and rheology modifier and a filler is used with the rheology modifier blocking the interaction between the free acid in the acid anhydride and the polar group on the surface of the filler. With the fluidity of a filler improved, a sealing layer which quickly packs a narrow gap with no bubbles caused is formed for improved reliability and productivity. |
