| 摘要 |
PROBLEM TO BE SOLVED: To reduce a signal transmission path and to improve electrical conductivity by laminating two semiconductor chips at a wafer level for packaging. SOLUTION: In upper and lower semiconductor chips as upper and lower wafers 10 and 20, surfaces where bonding pads 11 and 21 are arranged are arranged at upper and lower parts with a specific interval. Then, lower insulation layers 40 and 41 are coated so that the bonding pads 11 and 21 are exposed to each semiconductor. Further, one end of upper and lower metal patterns 31 and 32 is connected to the bonding pads 11 and 21, and the metal patterns 31 and 32 are deposited onto the first insulation layers 40 and 41. At this time, the lower metal pattern 32 is formed longer than the upper metal pattern 31. A solder ball 90 is mounted to the pattern film for packaging. |
