| 摘要 |
<p>A method for producing a wiring board having sufficient adhesion between the surface of a conductor layer and an interlayer insulating layer by laminating an interlayer insulating layer (5) on a lower layer pattern (2). The surface of the lower layer pattern (2) is roughened and subjected to tin displacement plating, and the interlayer insulating layer (5) is formed on the lower-layer pattern (2). Since the surface of the lower-layer pattern (2) is covered with tin and formation of an oxide film on the lower-layer pattern (2) is prevented, sufficient adhesion is ensured between the lower layer pattern (2) and the interlayer insulating layer (5).</p> |
