| 摘要 |
Individual test connectors (30) resemble leaf springs. They contact test points (120) on the wafer being examined (100). The base (20) is silicon, with inclined locations formed by anisotropic etching. A layer of insulant separates the test connectors. A layer of conductive material (35) is formed on the insulating layer; together these two layers form the leaf spring test connector (30). The substrate holds numerous test connectors. Its surface is plane, the connectors being bonded-on, with diagonal inclination. The test connector substrate has tracks on its surface, to complete signal paths from the leaf spring test connectors to external components An independent claim is included for the corresponding method of making the test connection structure in silicon. A further distinct claim covers a handling mechanism, used to pick up a micro-connection element (the leaf spring), orientate it, and mount it on a substrate.
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