A method and device for selective heating of subsurface structures in material such as tissue includes a cooling device for thermally quenching or removing heat from the top surface of tissue during or just after delivering pulsed energy to target or subsurface structures or tissue, a preferred embodiment of the invention using dynamic cooling, to quench the thermal energy conducted from the targeted structure into surrounding tissue.
申请公布号
WO0108545(A2)
申请公布日期
2001.02.08
申请号
WO2000US20311
申请日期
2000.07.25
申请人
LASER AESTHETICS, INC.;KOOP, DALE, E.;BAUMGARDNER, JONATHAN, M.;WEISS, ROBERT, A.
发明人
KOOP, DALE, E.;BAUMGARDNER, JONATHAN, M.;WEISS, ROBERT, A.