Offset edges mold for plastic packaging of integrated semiconductor devices

摘要

A mold for plastic packaging of an integrated semiconductor device composed of two half shells closing on a perimetral dam-bar of a die-stamped assembly metal frame of the semiconductor dice disposed between the two half shells of the mold, the depressed central pad defining, at least along the zone of injection of the resin a slit between the perimetral portion of the frame and the central pad thereof through which the resin injected through an inlet channel flows to fill the upper part of the cavity of the mold, the edge of said central pad defining said flow slit being bent upward to form a spoiler intercepting the resin stream and directing part of the resin toward the relatively narrow space between the bottom of said depressed central pad of the frame and the lower half shell of said mold, has the inner edge of the upper half shell of the mold, that defines the internal cavity along the side of injection of the resin inwardly offset in respect to the opposite inner edge of the lower half shell of the mold. This offsetting cooperates with the spoiler in restricting the aperture of the flow slit.