| 发明名称 |
Semiconductor device including a ball grid array |
| 摘要 |
A semiconductor device includes a multi-layered ball grid array (BGA) substrate with lines and a semiconductor chip having electrodes respectively connected with the lines by soldering bumps wherein the soldering bumps on the periphery of the semiconductor chip are larger in size than soldering bumps in a central portion of the semiconductor chip.
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| 申请公布号 |
US6184586(B1) |
申请公布日期 |
2001.02.06 |
| 申请号 |
US19980066581 |
申请日期 |
1998.04.27 |
| 申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
MATSUSHIMA HIRONORI |
| 分类号 |
H01L21/48;H01L21/60;H01L23/12;H01L23/485;H05K3/12;H05K3/34;(IPC1-7):H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L21/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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