SUBSTRATE PLATING DEVICE

摘要

PROBLEM TO BE SOLVED: To improve the uniformity of the film thickness of a plating layer to be formed on the treating surface of a substrate. SOLUTION: This substrate plating device executes an electroplating treatment while supplying an electroplating liquid Q between the treating surface WS of the substrate W which is a cathode and a second electrode member 8 which is an anode so as to fill the electroplating liquid therebetween by maintaining both in a parallel state. An auxiliary cathode electrode member which is the cathode is arranged around the treating surface WS of the substrate W and the second electrode member 8 having an area larger than the area of the treating surface WS of the substrate W is disposed to face the treating surface WS of the substrate W and the auxiliary cathode electrode member. Openings 7 are formed at the second electrode member 8. The treating surface WS of the substrate W and the second electrode member 8 are arranged to face each other in such a manner that the opening diameter (r) of the openings 7 and the distance D between the treating surface WS of the substrate W and the second electrode member 8 satisfies [r/2<=D<=2r]. The first electrode member is electrically connected to the treating surface WS of the substrate W over the entire circumference along the peripheral edge of the treating surface WS of the substrate W.