EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR AND SEALED SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing semiconductor which has high resistance to soldering in a moisture absorbed state and is excellent in continuous moldability. SOLUTION: This epoxy resin composition comprises no fewer than two ingredients consisting of an epoxy resin of formula I [wherein the average of (n) is 0 to 5; and Gr is glycidyl group] and an epoxy resin of formula II as epoxy resins, and the compounded amounts of epoxy resins of formulae I and II are 15-85 wt.% and 5-50 wt.% respectively based on the total quantity of epoxy resins.