| 摘要 |
In a printed circuit board, electronic components such as a component having a pair of leading portions, a chip component having a pair of electrodes, and the like, are connected to circuit patterns; and a resist layer covering a copper foil portion formed as a ground pattern is removed in vicinity of the high-impedance side leading portion of the current leading component and the high-impedance side electrode of the chip component to thereby form removed portions so that discharge paths are formed between the copper foil portion exposed through the removed portions and the leading portion and the electrode.
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