| 摘要 |
In a control device the printed circuit board (10) rests on a rim (28) of the housing bottom (26). The power components (14) to be cooled are arranged in the area where the printed circuit board (10) rests on the rim (28). In order to achieve an even contact pressure of the printed circuit board (10) over the entire support surface, a contact pressure on the power component (14) or on the printed circuit board (10) is generated with the help of additional aids. It is possible here to use spring elements (30) or elastomer strips (31) acting on the power component (14). Furthermore, multi-part support elements (40), or respectively plastic elements (45) can also be employed, which respectively act directly on the printed circuit board (10). A good heat dissipation from the power component (14) via the rim (28) of the housing bottom is possible by means of this.
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