| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductivity suitable for handling electric and electronic parts while restraining the amount of a conductive filler added to a resin molding. SOLUTION: The resin molding for handling electric and electronic parts contains a matrix comprising a molded resin material and a conductive filler dispersed in the matrix and is subjected to voltage application. The conductive filler is, for example, a metal material and a carbon material and the applied voltage is set at, for example, 1,000 V or more and below the dielectric breakdown voltage of the resin material.
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