发明名称 Constraining ring for use in electronic packaging
摘要 A constraining ring increases the modulus of an interconnect substrate to maintain flatness of the substrate. The constraining ring is made of materials selected to match the coefficient of thermal expansion of the substrate to that of the constraining ring. Circuit components including capacitors and resistors are formed on the constraining ring to provide enhanced electrical properties without adding to the size of the device.
申请公布号 US6184589(B1) 申请公布日期 2001.02.06
申请号 US19980195052 申请日期 1998.11.18
申请人 BUDNAITIS JOHN J.;FISCHER PAUL J.;HANSON DAVID A.;NODDIN DAVID B.;SYLVESTER MARK F.;PETEFISH WILLIAM GEORGE 发明人 BUDNAITIS JOHN J.;FISCHER PAUL J.;HANSON DAVID A.;NODDIN DAVID B.;SYLVESTER MARK F.;PETEFISH WILLIAM GEORGE
分类号 H01L21/48;H01L23/498;H01L23/538;(IPC1-7):H01L23/02 主分类号 H01L21/48
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