发明名称 BINDING BAND STICKING APPARATUS
摘要 PROBLEM TO BE SOLVED: To certainly stick a double-wound binding band at its projected cutting parts and to certainly remove the binding bands after being cut. SOLUTION: A sticking apparatus 10 comprises a processing stage 11 for mounting a bundle T thereon, a pusher mechanism 20 which moves the bundle T placed on the processing stage 11 toward a place for accumulation, a stopper mechanism 31 which makes trimming at the short side end of the bundle T, a pusher mechanism 32 which holds the bundle T from both sides in collaboration with the stopper mechanism 31 and shifts a bunch t which is a part of the bundle T, an insertion mechanism 40 which inserts a plate 41 into a space A formed between the bunch t and a large band K, and a sticking mechanism 50 which holds the large band K from both sides with the plate 41 and heats and melts the band for sticking overlapped parts of the large band together. As a part of the band that comes to the inside and a part of the band that comes to the outside are stuck together, being held between the plate 41 and a heater head 51, sticking is made certainly only to the large band K, and sticking to papers or the like can be prevented.
申请公布号 JP2001031009(A) 申请公布日期 2001.02.06
申请号 JP19990200508 申请日期 1999.07.14
申请人 TOSHIBA CORP 发明人 KURIHARA AKIO;NAGAO MASAHIRO
分类号 B65B27/08;B65B13/32;(IPC1-7):B65B27/08 主分类号 B65B27/08
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