| 摘要 |
PROBLEM TO BE SOLVED: To obtain a prepreg having a low moisture absorption by bringing a sheet of a resin composition containing an epoxy resin, a curing agent, and a phenolic-hydroxyl-containg polyamide resin and/or a phenolic-hydroxyl- containing polyamide-polybutadiene-acrylonitrile copolymer into tight contact with a substrate to be thermally fused and impregnated. SOLUTION: The resin composition comprises an epoxy resin (A) such as a polyfunctional epoxy resin, a curing agent (B) selected from among acid anhydrides, amines, phenols, etc., and a phenolic-hydroxyl-containing polyamide resin (C), and/or a phenolic-hydroxyl-containing polyamide-polybutadiene- acrylonitrile copolymer (D). The equivalent ratio of ingredient B to epoxy groups of ingredient A is 0.3 to 2.0, and the sum of ingredients C and D accounts for 10 to 90 wt.% of the composition. A sheet formed of the composition is brought into contact with one or both side, of a substrate such as a woven or nonwoven aramid fabric to be thermally fused and impregnated, thus giving a prepreg.
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