发明名称 EPOXY RESIN COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR
摘要 PROBLEM TO BE SOLVED: To obtain a resin composition small in decrease of light transmittance even under high-temperature and high-humidity conditions and excellent in workability and soldering reflow resistance by mixing an epoxy resin with a polycyclic phenol and an accelerator. SOLUTION: The epoxy resin used is exemplified by a polyfunctional epoxy resin being a glycidyl ether compound of a polyphenol compound. The polycyclic phenol acts as a curing agent for the epoxy resin and is desirably e.g. a compound represented by formula I or II. It is used in an amount of 0.4-1.5 eq per eq epoxy groups of the epoxy resin. The accelerator has a function of accelerating the cure of the epoxy resin and is exemplified by 2-methylimidazole. In preparing the composition, the respective components are mixed with each other, and the mixture is kneaded at a temp. of 80-120 deg.C, cooled, and ground into a powdery composition. When the components are liquid, they are uniformly dispersed with e.g. a planetary mixer to form a composition.
申请公布号 JP2001031742(A) 申请公布日期 2001.02.06
申请号 JP19990209770 申请日期 1999.07.23
申请人 NIPPON KAYAKU CO LTD 发明人 UMEYAMA TOMOE;KOBAYASHI TAKUMI;KAWADA YOSHIHIRO;IMAIZUMI MASAHIRO;NIIMOTO HARUKI
分类号 C08G59/62;H01L23/29;H01L23/31;(IPC1-7):C08G59/62 主分类号 C08G59/62
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