发明名称 |
Self aligning wafer chuck design for wafer processing tools |
摘要 |
A wafer chuck for positioning and releasably holding a wafer includes a support platform having an upper surface for positioning and supporting the wafer. Wafer banking pins are affixed to the support platform for positioning the wafer. A lift device acting on the wafer when it rests on the support platform to move the wafer relative to the support platform in a slanted direction away from the support platform and wafer banking pins. The lift device has a plurality of wafer lifting fingers that cooperatively extend in a biased and substantially vertical direction are disposed in a pattern to be supportive of the wafer. Each of the wafer lifting fingers has an end portion that is movable relative to the support platform between a first position at which it is retracted from the upper surface of the support platform and a second position at which it protrudes from the upper surface of the support platform so as to engage the wafer to lift it relative to the support platform.
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申请公布号 |
US6183189(B1) |
申请公布日期 |
2001.02.06 |
申请号 |
US19980200550 |
申请日期 |
1998.11.27 |
申请人 |
CHARTERED SEMICONDUCTOR MANUFACTURING, LTD. |
发明人 |
LZU ERZHUANG;TANG XIAOSONG;LIN YIH-SHUNG;LIN CHARLES |
分类号 |
H01L21/683;(IPC1-7):H01L21/68 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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