发明名称 Slurry recycling apparatus and slurry recycling method for chemical-mechanical polishing technique
摘要 A first pump collects used slurry which is employed for a CMP technique. A new slurry supply device supplies new slurry having a concentration higher than a concentration of the used slurry, to the used slurry. A sensor measures a concentration of recycled slurry produced by mixing the used slurry with the new slurry. The new slurry supply device stops supplying the new slurry, in a case where the concentration which the sensor measures is equal to or above a predetermined value. A second pump supplies recycled slurry onto a polishing stage, after the used slurry is completely recycled.
申请公布号 US6183352(B1) 申请公布日期 2001.02.06
申请号 US19990382640 申请日期 1999.08.25
申请人 NEC CORPORATION 发明人 KURISAWA SHUU
分类号 B24B57/00;B24B37/00;B24B57/02;(IPC1-7):B24C9/00 主分类号 B24B57/00
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