| 摘要 |
PROBLEM TO BE SOLVED: To obtain a sealing medium excellent in reliability in bonding and gold when a semiconductor device is kept at high temperatures while maintaining flame retardancy of the medium. SOLUTION: This epoxy resin composition for sealing semiconductors essentially comprises (A) an epoxy resin, (B) a phenolic resin-based curing agent, (C) an inorganic filler (D) a brominated epoxy resin and (E) a curing accelerator; wherein the amount of the brominated epoxy resin to be included is 0.1-0.2 wt.% calculated as Br element content based on the whole epoxy resin composition, a triphenylphosphine-benzoquinone complex as the curing accelerator to be included is 0.2-10 wt.% based on the total content of the epoxy resin and the curing agent and also <0.1 wt.% of antimony pentoxide is added to the composition. Using the epoxy resin composition thus obtained, a semiconductor element is sealed.
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