发明名称 CURABLE EPOXY RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain an epoxy resin composition excellent in storage stability and curability and capable of giving a cured product excellent in adhesion and curing properties by mixing a polyepoxy compound with a curing agent composition prepared by reacting an amine compound with a dicarboxylic acid dihydrazide, and an organic polyisocyanate. SOLUTION: This composition is a one-package heat-curable epoxy resin composition comprising 100 pts.wt. (A) polyepoxy compound and 0.1-200 pts.wt. (B) latent curing agent composition prepared by reacting an amine compound represented by the formula (wherein R1 and R2 are each a 1-8C alkyl or may be combined with each other to form an alkylene which may contain O or N; and n is 1-6) with a dicarboxylic acid dihydrazide and an organic polyisocyanate. Component B may be a curing agent composition obtained by reacting the above three components with an amine compound other than the amine compound of the formula and/or an epoxy compound.
申请公布号 JP2001031738(A) 申请公布日期 2001.02.06
申请号 JP19990209982 申请日期 1999.07.23
申请人 ASAHI DENKA KOGYO KK 发明人 OGAWA AKIO;ABE MANABU
分类号 C08G59/40;(IPC1-7):C08G59/40 主分类号 C08G59/40
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