| 摘要 |
A ball grid array package with conductive leads comprising a silicon chip, a heat sink, a plurality of conductive leads, bonding wires, and solder balls, a substrate and a molding compound. The conductive leads and the substrate are positioned below the heat sink such that the conductive leads are sandwiched between one surface of the substrate and the heat sink. The heat sink has a die-attach region for attaching the silicon chip. The silicon chip is electrically connected to contact points on another surface of the substrate and the conductive leads by bonding wires. The conductive leads are directly mounted to a printed circuit board. The contact points on the other surface of the substrate are electrically connected to the printed circuit board through trace lines inside the substrate and the solder balls attached to some of the contact points. The bonding wires, a portion of the conductive leads, and the silicon chip are enclosed by the molding compound for better protection.
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