ADHESIVE FOR SEMICONDUCTOR AND ADHESIVE TAPE FOR SEMICONDUCTOR

摘要

PROBLEM TO BE SOLVED: To provide an adhesive for a semiconductive apparatus having a stress relaxation effect which is used for preparing an adhesive tape with reduction of curloccurrence and an adhesive tape for the semiconductive apparatus prepared by its use. SOLUTION: An adhesive for a semiconductor is composed of a thermosetting adhesive resin and a thermosetting adhesive composition containing elastic fine particles wherein the elastic fine particles are contained in 5-60 wt.% and a dynamic elastic modulus after curing the thermosetting adhesive composition ranges from 100 MPa to 800 Mpa at 25 deg.C and 3 MPa to 50 Mpa at 150 deg.C. The adhesive layer is formed on a support using this adhesive for the semiconductor to make an adhesive tape.