发明名称 PROTECTIVE SYSTEM FOR INTEGRATED CIRCUIT (IC) WAFERS
摘要 <p>A container (11) for integrated circuit wafers (19) provides protection for the wafers from mechanical shock and electrical charges. The wafers are mechanically protected by top and bottom cushions (21, 23) and side cushions (25). The top and bottom cushions each have foam (27) within a membrane or film (29) enclosure. The enclosure has openings (31) so as to allow gas (33) to pass in and out. The side cushions have resilient projections (41) that protect the edges of the wafers. The side cushions are interposed between flanges (38) of the top and bottom cushions. The individual wafers are separated from each other by leaf separators (20) made of film. The film (29) for the separators (20) and the top and bottom cushions (21, 23) can be the same type. The film has a first layer (51) made of a polymer with dissipative material therein and a second layer (53) made of a polymer without a dissipative material. The container has a grounding stud (73) in a wall.</p>
申请公布号 WO2001007339(A1) 申请公布日期 2001.02.01
申请号 US2000020024 申请日期 2000.07.21
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