EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

摘要

An epoxy resin composition which combines rapid-curing ability and storage stability and is useful in the field of electronic/electrical materials. The composition comprises (A) a compound having two or more epoxy groups per molecule, (B) a cocondensate having two or more phenolic hydroxyl groups per molecule, and (C) an association product made up of (X) a tetra-substituted phosphonium, (Y) a compound having two or more phenolic hydroxyl groups per molecule, and a conjugate base of (Y) a compound having two or more phenolic hydroxyl groups per molecule, and is characterized in that the conjugate base is a phenoxide compound formed by removing one hydrogen atom from the compound (Y) having two or more phenolic hydroxyl groups per molecule.