| 摘要 |
<p>The invention concerns a method for making a device such as a smart card, comprising a card body and an integrated circuit chip comprising bond sites with antenna contact pads and/or connection pads. The invention is characterised in that it comprises steps which consist in: providing rather thin large-size integrated circuits (2), comprising output pads (4) on their active face; producing, in particular by printing or fixing, antenna contact pads (5) and/or connection pads and optionally an antenna inside the surface area of said active face, and producing connections for forming an electronic module; if required, cutting out individual circuits each forming an electronic module (8); and transferring onto the card body (9) at least one such electronic module, and optionally connecting an antenna. The invention is useful for making smart cards with and/or without contact.</p> |
