| 发明名称 |
Klebstoffe für stromlose Metallisierung und Leiterplatten |
| 摘要 |
<p>An adhesive usable for electroless plating in the formation of printed circuit boards is formed by dispersing a cured heat-resistant resin powder soluble in an acid or an oxidizing agent into an uncured heat-resistant resin matrix hardly soluble in an acid or an oxidizing agent after the curing treatment, in which the heat-resistant resin matrix is a mixture of a thermoplastic resin and an uncured thermosetting resin or an uncured photosensitive resin. <IMAGE></p> |
| 申请公布号 |
DE69426472(D1) |
申请公布日期 |
2001.02.01 |
| 申请号 |
DE1994626472 |
申请日期 |
1994.05.18 |
| 申请人 |
IBIDEN CO. LTD., OGAKI |
发明人 |
WANG, DONG DONG;ASAI, MOTOO |
| 分类号 |
C08J3/00;C08L63/00;C08L63/10;C08L71/00;C09J171/00;C23C18/20;H05K3/00;H05K3/18;H05K3/46;(IPC1-7):C08J3/00;C09J101/00;C09J163/00;C09J181/06 |
主分类号 |
C08J3/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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