| 摘要 |
An apparatus (30) for controlling the temperature within a sealed enclosure (10) housing electronic components (E) whose operation produces heat, and whose operation should occur within a desired temperature range. A heat sink (32) extending through an enclosure end wall (14) of the enclosure (10) conducts heat from within the enclosure (10) to the atmosphere. Other heat sinks (40) mounted within the enclosure (10) are in a heat transfer relationship with the components (E) to draw heat generated thereby to the heat sinks. A heat pipe (50) extending between the respective heat sinks (32, 40) conducts heat to the first heat sink to expel the heat to the atmosphere. A heater (60, 62) within the enclosure (10) generates heat to heat the components (E), and a thermostat (72, 74) senses when the temperature within the enclosure (10) falls below a predetermined temperature in order to energize the heater (60, 62). The heater (60, 62) is sized to cause a "dry out" condition in the heat pipe (50), and to thereby maintain the temperature within the enclosure (10) within the desired range by controlling the heat transfer path of the heat pipe (50).
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