| 摘要 |
<p>Contaminant adhering to a wafer is reduced by solving a conventional problem that contaminant enters a semiconductor from the outside container through a gap between the semiconductor container and the wall face of a device for opening/closing the container when the opening/closing device opens the cover of the semiconductor container and adheres to a wafer, and thereby preventing contaminant from entering the container when it is opened by means of the opening/closing device. The ratio of the maximum speed at which the cover of the semiconductor container is opened perpendicularly to the opening thereof to the pressure difference between the inside and outside of a semiconductor production system is set to 0.06 ((m/s)/Pa) or less.</p> |
