发明名称 METHOD OF MANUFACTURING CERAMIC ELECTRONIC COMPONENTS
摘要 Method of manufacturing ceramic electronic components comprising; a first process for providing a ceramic sheet containing at least ceramic component and polyethylene and providing a conductive layer formed on a base film; a second process for stacking the conductive layer on the ceramic sheet and pressing, and then peeling the base film off; a third process of disposing the ceramic sheet on the conductive layer; a fourth process for stacking the conductive layer on the ceramic sheet and pressing, and then peeling the base film off; a fifth process for forming a laminated body by repeating the third process and the fourth process; and a sixth process of sintering the laminated body. Short-circuiting between electrode layers in the multi-layered ceramic electronic components can be avoided. Production yield increases. The method is especially effective in the production of multi-layered ceramic capacitors where a large number of layers are laminated and layer thickness is very thin.
申请公布号 WO0108177(A1) 申请公布日期 2001.02.01
申请号 WO2000JP04868 申请日期 2000.07.21
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.;KURAMITSU, HIDEKI;NAGAI, ATSUO;SAKAGUCHI, YOSHIYA;MIURA, YOSHIYUKI 发明人 KURAMITSU, HIDEKI;NAGAI, ATSUO;SAKAGUCHI, YOSHIYA;MIURA, YOSHIYUKI
分类号 H01G4/12;H01G4/30;H05K1/03;H05K3/20;H05K3/46 主分类号 H01G4/12
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