| 摘要 |
A thermally-coupled heat-dissipation apparatus (10) surrounds a solid state electronic device mounted on an adapter circuit board (14) or a thermal transfer column (74) extending upwardly from a main board socketed device. The apparatus (10) includes at least two heat sinks (18 and 20) positioned in a spaced parallel relationship on front and back sides (22 and 28) of the adapter circuit board (14) or thermal transfer column (74). A bridge member (38) thermally couples the two heat sinks (18 and 20). A plurality of fans (42) are mounted along outer surfaces of the heat sinks (18 and 20). In a preferred embodiment, the bridge member (38) is an additional heat sink, but could be a metal plate in alternate embodiments. The preferred device to cool using the present invention is a computer processor (12). |
