发明名称
摘要 PURPOSE:To mold a resin molding product of an extremely thin package and also to surely and stably mold resin. CONSTITUTION:An article 10 to be formed such as a lead frame is clamped by a molding die and resin is molded. In this equipment for molding resin, bottom members 28, 30 whose end faces constitute the inner face of a cavity are slidably provided in the direction for opening/closing this molding die on the bottom part of the cavity 16 of the molding die. Driving mechanisms 32, 34 are provided so that the bottom members are pushed between the position wherein the end faces of the bottom members retreat from thickness of a package being a molded form and the position wherein this molded form is pushed out at a time for mold rease. A controlling mechanism is provided so that the bottom members are evacuated in the retreating position in the case of introducing resin into the cavity and the end faces of the bottom members are extruded to the position of dimension having the prescribed thickness of the package and resin is molded into a required shape.
申请公布号 JP3131474(B2) 申请公布日期 2001.01.31
申请号 JP19910304284 申请日期 1991.10.22
申请人 发明人
分类号 B29C33/02;B29C33/12;B29C45/02;B29C45/14;B29C45/26;B29C45/76;B29K105/20;B29L31/34;H01L21/56;(IPC1-7):B29C45/26 主分类号 B29C33/02
代理机构 代理人
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