Hot melt pressure sensitive adhesive based on acrylates

摘要

The invention relates to a process for the preparation of acrylate-based pressure-sensitive hot-melt adhesives by irradiation on a substrate, characterized in that a) at least one acrylic monomer is copolymerized with N-tert.-butylacrylamide (TBA), wherein b) the reaction mixture (of a) to be polymerized can additionally contain one or more ethylenically unsaturated compounds which do not belong to the group of acrylic monomers of a), c) the resulting solid polymer is heated and is applied in a form which is capable of flowing or a liquid form to a substrate, it being possible for the compositions of steps a) to c) to contain additives and auxiliaries if appropriate, and d) the coated substrate is irradiated with high-energy radiation.