| 摘要 |
<p>PURPOSE:To decrease the warps of a board and improve the conductivity of inner wiring by forming inner wiring, using the conductive paste which includes the glass frit having the yield point lower than the sintering start temperature of a board, inside the laminated board, where the boards consisting of the ceramic boards including glass frit are stacked, and specifying the yield point of the glass frit. CONSTITUTION:In manufacture of a multilayer circuit board 1, first a laminated board 2 is made. The laminated board 2 can be gotten by laminating the green sheets consisting of glass frits and baking them integrally. In case that the yield point of the glass frit is higher than the sintering start temperature of the board, the multilayer circuit board, where warps are few, can not be realized, so as glass frit, for example, B2O3-SiO2-CaO-Al2O3 can be cited. Among them, especially the glass frit, whose yield point is 700-845 deg.C, is desirable. Moreover, for the glass frit, in case of using the Ag conductive powder as a conductive material, it is added by 30-55wt.% of the Ag conductive powder. Hereby, a multilayer circuit board, where the warps of the board are few, and the resistance value of the inner wiring is small, can be realized.</p> |
