Hot melt pressure sensitive positioning adhesive (iii)

摘要

The present invention is a hot melt pressure sensitive positioning adhesive for use with an absorbent article. The adhesive comprises:(a) from 5 to less than 15 percent by weight of a blend of(i) a hydrogenated styrene-(butadiene or isoprene)-styrene block copolymer having a polystyrene block number average molecular weight of 20,000 or less, and(ii) a homogeneous linear or substantially linear interpolymer of ethylene and at least one C3-C20 alpha olefin having a density from 0.85 to 0.91 grams per cubic centimeter; and(b) from 50 to 80 percent by weight of a tackifying resin which has an aromaticity such that the MMAP cloud point is at least 45° C.; and(c) from 5 to 35 percent by weight of a plasticizing oil.The block copolymer of (i) may also be one in which the polystyrene block molecular weight is greater than 20,000. In such case, the tackifying resin must have an aromaticity wherein the MMAP cloud point is at least 70° C.