| 摘要 |
An enclosure for spray cooling a plurality of circuit boards containing heat generating devices includes a chassis defining an enclosed chamber (24) that includes opposing walls (12, 14) with a plurality of rails (60) formed on the interior side of the opposing walls to define slots for receiving circuit boards. A coolant delivery system (36) includes a coolant delivery manifold in each of the opposing walls in fluid communication with a plurality of spray nozzles mounted to the rails on the walls. Each spray nozzle atomizes and discharges coolant into the chamber between the circuit boards in the slots. A plurality of apertures in the rails provide fluid communication between the chamber and a respective coolant return manifold to receive vaporized coolant from the chamber. A coolant supply system receives and cools coolant from the coolant return manifold and pumps cooled coolant to the coolant delivery manifold for delivery to the nozzles. Optionally, a sump (42) in the chamber is connected to the coolant supply system (36) to supply condensed coolant from the chamber. Also optionally, heat sinks (34) are integrally formed in the exterior sides of the opposite walls adjacent the coolant return manifolds. |
