Single station cutting apparatus for separating semiconductor packages

摘要

Apparatus for cutting single or multiple semiconductor packages from a multilayer substrate wherein the semiconductor packages are partially encapsulated by an elastomer sealant layer disposed on a polymer film layer of the substrate. The apparatus includes upper and lower die assemblies mounted for movement relative to each other on a support base. The upper die assembly includes an actuator and a die block supporting plural sets of cutter blades arranged in patterns to cut rectangular shaped semiconductor packages out of the substrate in a single cutting operation at a single station. The lower die assembly includes plural punch members movable relative to a die block, which includes a support surface for supporting the substrate in a predetermined position as determined by spaced apart locator pins on the lower die assembly registerable with corresponding locator holes in a carrier frame for the substrate. Separated or singulated semiconductor packages are retained by vacuum in recesses in the upper die assembly defined by the cutter blades and the packages are ejected by a burst of compressed air for further processing.