发明名称 GRINDING WHEEL AND METHOD FOR GRINDING DIAMOND, AND GROUND DIAMOND BODY
摘要 PROBLEM TO BE SOLVED: To grind a diamond or a self-standing diamond film formed on a substrate by a vapor phase synthesis method at a low temperature without degrading the quality, to maintain the stable performance of a grinding material, to use a conventional grinding device in surface grinding, and to efficiently grind a member covered by the three-dimensional diamond film. SOLUTION: In this diamond grinding method, a diamond grinding wheel consisting mainly of an intermetallic compound of Ti and one or two or more kinds of elements selected from a group of Al, Cr, Mn, Fe, Co, Ni and Cu is pressed against a relatively rotating or moving diamond and ground while keeping the grinding wheel at room temperature or heating a grinding part at 100-800 deg.C as necessary.
申请公布号 JP2001025971(A) 申请公布日期 2001.01.30
申请号 JP19990218850 申请日期 1999.08.02
申请人 AGENCY OF IND SCIENCE & TECHNOL;APPLIED DIAMOND:KK 发明人 ABE TOSHIHIKO;HASHIMOTO HITOSHI;TAKEDA SHUICHI
分类号 B24D3/00;B24B9/16;B24D3/02;(IPC1-7):B24D3/00 主分类号 B24D3/00
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