发明名称 HEAT-RESISTANT SUBSTRATE
摘要 <p>PROBLEM TO BE SOLVED: To improve lightweight properties, flexibility, heat resistance, chemical resistance and electric insulating properties and to obtain high photoelectric conversion efficiency by forming a coating film of a polyimide resin in which insulating fine particles are dispersed on the surface of a plastic film and providing a V-shaped groove structure with a specific angle to the surface of the coating film. SOLUTION: A coating film comprising a polyimide resin layer in which insulating fine particles are dispersed is formed on the surface of a plastic film and V-shaped grooves with an angle of 60-120 deg. are formed to the surface of the coating film. As the insulating fine particles, silica fine particles are especially pref. and the compounding amt. of the insulating fine particles to the polyimide resin layer is pref. 100-500 wt.% and the mean particle size of them is pref. 0.05-5.0μm and the standard deviation of the particle size distribution of them is especially pref. 1.2 or less. The V-shaped grooves achieve function increasing the surface area of an insulating substrate and irregularly reflecting incident solar rays to seal the same and the depth of them is pref. 5-20μm.</p>
申请公布号 JP2001026084(A) 申请公布日期 2001.01.30
申请号 JP19990199882 申请日期 1999.07.14
申请人 MITSUBISHI CHEMICALS CORP 发明人 HAYASHI ASAJI;YOSHIKAWA TAKEFUMI
分类号 H01L31/04;B32B27/34;(IPC1-7):B32B27/34 主分类号 H01L31/04
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