发明名称 POSITIONING METHOD AND DEVICE FOR BONDING MAGNETIC HEAD
摘要 PROBLEM TO BE SOLVED: To find an optimum bonding position by using image processing different from conventional pattern matching even in the presence of variance in the positional relation of a suspension and a slider. SOLUTION: In deciding a bonding position for electrically connecting by ball bonding between a slider electrode 10a on a slider side fixed on a suspension 4 and a suspension electrode 4a on the suspension side, illuminating light is emitted to a valley formed by an electrode arrangement face 10S of the slider 10 and that 4S of the suspension 4 in the manner that an incident angle is roughly 45 deg. to the suspension electrode face. Then, an image of the suspension electrode 4a is reflected to the slider electrode face 10S, catching the suspension electrode image before and after the reflection, and deciding the bonding position from the suspension electrode image before and after the reflection.
申请公布号 JP2001028113(A) 申请公布日期 2001.01.30
申请号 JP19990198817 申请日期 1999.07.13
申请人 TDK CORP 发明人 MIZUNO TORU;NAKAYAMA HITOSHI
分类号 G11B5/60;G11B21/21;(IPC1-7):G11B5/60 主分类号 G11B5/60
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