| 摘要 |
PROBLEM TO BE SOLVED: To provide a film forming device and a film forming method capable of film formation to a linear or granular material to be treated by simple device constitution and process. SOLUTION: A film forming device 10 is provided with a chamber connected with an exhaust system duct line 7 and a gas introduction system duct line 6, a cylindrical type cathode 2 set in the chamber and additionally provided with a target material 3 on the inner circumferential face, a meshlike cylindrical type anode 4 concentrically arranged at the inside of the cylindrical type cathode 2, a high pressure power source 5 applying high voltage to the space between the cylindrical type cathode 2 and the cylindrical type anode 4 and a treating material carrying means for continuously feeding the material 8 to be treated from the outside of the chamber to the inside of the cylindrical type anode 4 and discharging the material 8 to be treated after the film formation to the outside of the chamber.
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