| 发明名称 |
Method of making an electronic component using reworkable underfill encapsulants |
| 摘要 |
A method is disclosed for preparing an electronic assembly using a reworkable underfill encapsulant in which the encapsulant is cured in situ from a curable composition comprising one or more mono-functional maleimide compounds, or one or more mono-functional vinyl compounds other than maleimide compounds, or a combination of maleimide and vinyl compounds, a curing initiator and optionally, one or more fillers or adhesion promoters.
|
| 申请公布号 |
US6180187(B1) |
申请公布日期 |
2001.01.30 |
| 申请号 |
US19990469479 |
申请日期 |
1999.12.22 |
| 申请人 |
NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION |
发明人 |
MA BODAN;TONG QUINN K.;XIAO CHAODONG |
| 分类号 |
H01L21/50;C08F2/48;C08F283/00;C08F283/12;C08F290/14;C08F299/02;C08G18/28;H01L21/56;H01L23/29;H01L23/31;(IPC1-7):C08J7/04;C08F2/38 |
主分类号 |
H01L21/50 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
