发明名称 APPLICATION NOZZLE, METHOD AND APPARATUS FOR APPLICATION BY THE NOZZLE, AND APPARATUS FOR PRODUCING SEMICONDUCTOR USING THE APPARATUS
摘要 PROBLEM TO BE SOLVED: To perform the application of a viscous fluid with the amount of the fluid to be applied on a substrate made constant promptly and exactly by forming grooves extending radially from an outlet hole formed in the middle as a passage for the viscous liquid on an application surface and a support part at a position excluding the grooves. SOLUTION: Grooves 13a, 13b, 13c, 13d extending radially from the outlet hole 12 are formed on the application surface of an application nozzle. The cross sections of the grooves 13a, 13b, 13c, 13d are V-shaped, U-shaped, recessed, or shaped otherwise. In the middle of each side of a quadrangle, four protruding support parts 14a, 14b, 14c, 14d are formed to contact each side, so that the support parts 14a, 14b, 14c, 14d are arranged at positions of a cross around the outlet hole 12. The support parts 14a, 14b, 14c, 14d are to hold the clearance between the application surface of the application nozzle and a work, keep out of the largest application pattern to the application surface, and have a size ox a rectangle about 1-2 mm in the length of one side.
申请公布号 JP2001025699(A) 申请公布日期 2001.01.30
申请号 JP19990197193 申请日期 1999.07.12
申请人 TOSHIBA CORP 发明人 OSHIRO KENICHI
分类号 B05D1/26;B05B1/04;B05C5/02;(IPC1-7):B05C5/02 主分类号 B05D1/26
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