| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of processing wafers where the rotation of wafers of various sizes and have orientation flats, can be controlled simply. SOLUTION: This method comprises the steps of attaching a wafer adaptor 10 to a semiconductor wafer 1, the adapter 10 being engageable with the periphery of a semiconductor wafer 1 to make the outer edge circular, and lowering the wafer 1 vertically to at least two, upper and lower, sloped guide rails 2 and 3 while rotating the wafer 1, the rails 2 and 3 which are engaged rotatably with the outer circumferential circle of the adaptor 10, whereby a processing operation is performed onto at least one of the surfaces of the wafer 1 which is lowered sideways, while rolling. |
